Wafer chuck system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6611417
APP PUB NO 20020135968A1
SERIAL NO

09814067

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Abstract

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A chuck system applicable to semiconductor fabrication processes for holding a workpiece that includes a pedestal that has an upper surface for supporting a semiconductor wafer, a plurality of gas holes and grooves. The gas holes pass through the pedestal and provide channels for gas to reach the semiconductor wafer. The grooves are formed on the upper surface of the pedestal and connect between the gas holes.

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Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPORATIONNO 8 KEYA 1ST RD DAYA DIST CENTRAL TAIWAN PARK TAICHUNG CITY 428

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fu-Sheng Hsinchu, TW 8 129

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