Electronic assembly comprising substrate with embedded capacitors
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United States of America Patent
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Aug 26, 2003
Grant Date -
N/A
app pub date -
Jul 31, 2000
filing date -
Jul 31, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
To reduce switching noise, the power supply terminals of an integrated circuit die can be coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic substrate. In one embodiment, the capacitor is formed of at least one high permittivity layer. In another embodiment, several high permittivity layers are interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.
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