Apparatus and methods for manipulating semiconductor wafers
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United States of America Patent
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Sep 2, 2003
Grant Date -
Jul 18, 2002
app pub date -
Jan 12, 2001
filing date -
Jan 12, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The present invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and a plurality of flow diverters positioned within the vacuum plenum to define vacuum distribution channels in fluid communication with respective vacuum ports of the vacuum chuck. The present invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums which are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters of the vacuum chucks adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The wafer handling system also includes a gas dispensing showerhead that may be positioned above a vacuum chuck for flattening the wafer so that a vacuum chuck can establish a secure engagement. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage.
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