High density interconnection system
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United States of America Patent
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-
Sep 2, 2003
Issued Date -
N/A
app pub date -
Aug 28, 2002
filing date -
May 21, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density interconnection system (100) includes a daughter card header (1) and a backplane receptacle (2). The daughter card header comprises an insulative housing (10) and a number of signal terminals (14) and grounding members (15) received in the housing. The insulative housing is composed of a number of modularized housing portions (11, 12, 13) mechanically assembled with each other. The backplane receptacle has an insulative base (20), a cover (26) attached onto the insulative base, a plurality of circuit boards (27) arranged between the base and the cover, and a plurality of signal contacts (24) and grounding elements (25) received in the insulative base. The insulative base is composed of a plurality of modularized base sections (21, 22, 23) mechanically assembled with each other. The header and the receptacle each have a plurality of fastening means (117, 127, 127', 137, 204, 205) formed thereon to interconnect the plurality of housing portions and base sections.
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