Module with bumps for connection and support
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 2, 2003
Issued Date -
N/A
app pub date -
Dec 22, 2000
filing date -
Dec 22, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic packaging module for inverted bonding of electronic devicss including semiconductor devices, integrated circuits, application specific integrated circuits, electomechanical devices and MEMS is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of electronic devices. The input/output pads of the devices may be simultaneously bonded to the protuberances of the packaging module.
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