Socket apparatus and method for removably mounting an electronic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 2, 2003
Grant Date -
Apr 24, 2003
app pub date -
Oct 22, 2001
filing date -
Oct 25, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).
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