Memory module having series-connected printed circuit boards

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6614664
APP PUB NO 20020048157A1
SERIAL NO

09924758

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted thereon, and signal lines and connection means for electrically connecting the printed circuit boards to one another. The connection means electrically series-connects the signal lines of each of the printed circuit boards. Preferably, an end termination circuit is formed on a terminal of the signal line of the farthest printed circuit board from a connector of a mother board, and the memory chip performs at a speed of approximately 150.about.300 MHz. The connection means is a flexible jumper assembly having a flexible film and a jumper line formed on the flexible film. Each of the printed circuit boards further comprises a jumper pad connected with the signal lines. The flexible jumper assembly interconnects the jumper pads of each of the printed circuit boards to one another. Among a plurality of the printed circuit boards, conductive leads are formed on an edge of one of the printed circuit boards. The conductive leads serve to connect the circuit boards with the connection means. The printed circuit board comprising the conductive leads is disposed on the first or the final of a plurality of the printed circuit boards. The jumper pads of each of the printed circuit boards are disposed opposite to the corresponding jumper pads of the other printed circuit boards.

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First Claim

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Dong Yang Seongnam, KR 21 285

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