Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
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United States of America Patent
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Sep 9, 2003
Grant Date -
N/A
app pub date -
Mar 31, 2000
filing date -
Mar 31, 2000
priority date (Note) -
Expired
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Abstract
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path.
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