Stress relief bend useful in an integrated circuit redistribution patch
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United States of America Patent
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-
Sep 9, 2003
Grant Date -
May 9, 2002
app pub date -
Sep 18, 2001
filing date -
Oct 29, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.
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