Apparatus for delivering power to high performance electronic assemblies
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United States of America Patent
Stats
-
Sep 9, 2003
Grant Date -
Nov 1, 2001
app pub date -
Mar 8, 2001
filing date -
Jul 15, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.
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