Method for manufacturing a high resolution intravascular ultrasound transducer assembly having a flexible substrate
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United States of America Patent
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Sep 16, 2003
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N/A
app pub date -
Apr 17, 2000
filing date -
Jan 8, 1997
priority date (Note) -
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Abstract
Several methods for fabricating an ultrasound transducer assembly having a flexible circuit are provided. Preferably, the method comprises attaching an ultrasound transducer array and integrated circuitry to the flexible circuit during fabrication of the ultrasound transducer assembly while the flexible circuit is in a:substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes.
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