Abrasive composition containing organic particles for chemical mechanical planarization
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United States of America Patent
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Sep 16, 2003
Grant Date -
Jul 24, 2003
app pub date -
Dec 21, 2001
filing date -
Dec 21, 2001
priority date (Note) -
Expired
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Abstract
The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
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