Importance

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Abstract

A semiconductor device comprises a first plate-like base substrate having a substantially rectangular extrapolated outer shape in a plane parallel to the primary surface thereof, and the first plate-like base substrate has a base electrode on the rear surface thereof. A second plate-like base substrate is connected to the primary surface of the first plate-like base substrate, and the second plate-like base substrate has a substantially same extrapolated outer shape in a plane parallel to the primary surface of the first plate-like base substrate. The second plate-like base substrate has a penetrating hole perpendicular to the primary surface of the first plate-like base substrate. A plate-like cap member is connected to the second plate-like base substrate to cover the penetrating hole in the second plate-like base substrate. A semiconductor chip is housed in a cavity surrounded by the first plate-like base substrate, the second plate-like base substrate and the plate-like cap member, and the semiconductor chip is electrically connected to the base electrode. Further, the first and second plate-like base substrates are cut off at each ridge portion of the side surfaces thereof which correspond to a corner portion of the substantially rectangular extrapolated outer shape.

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First Claim