Resistor component with multiple layers of resistive material
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United States of America Patent
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Sep 23, 2003
Grant Date -
N/A
app pub date -
Sep 22, 2000
filing date -
Sep 22, 2000
priority date (Note) -
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Abstract
A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 .ANG. and 70 .ANG. is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 .ANG. and 500 .ANG. is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 .ANG. and 500 .ANG. is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
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