Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards
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United States of America Patent
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Sep 23, 2003
Grant Date -
N/A
app pub date -
Feb 12, 2002
filing date -
Feb 12, 2002
priority date (Note) -
In Force
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Abstract
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can include a die, an interposer substrate, a solder-ball, and a dielectric compound. The die can have an integrated circuit and at least one bond-pad coupled to the integrated circuit. The interposer substrate is coupled to the die and can have at least one ball-pad electrically coupled to the bond-pad on the die. The interposer substrate can also have a trace line adjacent to the ball-pad, and a solder-mask having an opening over the ball-pad. The solder-ball can contact the ball-pad in the opening. The dielectric compound can insulate the ball-pad and the solder-ball from an exposed portion of the adjacent trace line in the opening.
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