Conductive adhesive and biomedical electrode

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United States of America Patent

PATENT NO 6623664
APP PUB NO 20030088239A1
SERIAL NO

10130591

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Abstract

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The conductive adhesive of the present invention has a multi-layer structure comprising a hydrophobic phase containing an adhesive polymer, and a hydrophilic phase containing an electrolyte. This conductive adhesive is superior in anti-drying effect (moisturizing effect) because a humectant is effectively contained in the hydrophilic phase. The present invention also relates to a biomedical electrode using such a conductive adhesive. In the biomedical electrode according to the present invention, an adhesive layer to be applied to the skin surface of the human body contains the conductive adhesive described above and an electrode terminal connected with the adhesive layer is provided.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYP O BOX 33427 ST PAUL MN 55133-3427

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suwa, Toshihiro Sagamihara, JP 25 281
Takaki, Shunsuke Sagamihara, JP 15 368

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