Rubber-modified epoxy resin composition

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United States of America Patent

PATENT NO 6624260
APP PUB NO 20020016411A1
SERIAL NO

09834107

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Abstract

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By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.

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Patent Owner(s)

Patent OwnerAddress
KANEKA CORPORATIONOSAKA-SHI OSAKA 530-8288

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Katsuhiro Hyogo, JP 17 95
Kawakubo, Fumio Hyogo, JP 28 735
Takase, Junji Hyogo, JP 24 314

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