Miniature semiconductor package for opto-electronic devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 23, 2003
Issued Date -
N/A
app pub date -
Aug 3, 2001
filing date -
May 9, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
The present invention pertains to using a leadless leadframe package as the semiconductor device package component of an opto-electronic combinational device. Leadless leadframe packages (LLPs) have very small form factors that allow an opto-electronic device to also have a small overall form factor.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully