Micromirror device package fabrication method
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United States of America Patent
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Sep 23, 2003
Grant Date -
N/A
app pub date -
Mar 12, 2001
filing date -
Mar 12, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about the micromirror device area thus protecting the micromirror device area from moisture and contamination.
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