MODULAR SPRAY COOLING SYSTEM FOR ELECTRONIC COMPONENTS
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United States of America Patent
Stats
-
Sep 23, 2003
Grant Date -
Oct 16, 2003
app pub date -
Apr 11, 2002
filing date -
Apr 11, 2002
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A modular spray cooling system 10 for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure 12 with an inside wall 14. A spray cooling module 26 is detachably mountable within the sealed enclosure 12. The coolant is distributed to a spray manifold card 48 that is provided with nozzles. Localized cooling is accomplished with the use of individual nozzles 17. The spray cooling module 26 atomizes the evaporative coolant through nozzles 22 so that liquid droplets of the coolant are delivered to the electronic components, and cooling of the components occurs upon evaporation. A method for cooling electronic components comprises the steps of: providing a sealed enclosure 12; priming the sealed enclosure 12 with an evaporative coolant that recirculates therewithin; detachably placing within the enclosure one or more sealed circuit card assemblies 24 containing the electronic components to be cooled; a spray cooling module 26 within the enclosure and delivering power to a pump within a spray cooling module 26 that is also detachably mountable within the sealed enclosure 12.
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