Dissection of printed edges from a fabrication layout for correcting proximity effects
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United States of America Patent
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Sep 23, 2003
Grant Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Sep 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
Techniques for fabricating a device include forming a fabrication layout, such as a mask layout, for a physical design layer, such as a design for an integrated circuit, and identifying evaluation points on an edge of a polygon corresponding to the design layer for correcting proximity effects. Techniques include correcting for proximity effects associated with an edge in a first fabrication layout by determining whether any portion of the edge corresponds to a target edge in a design layer. The first fabrication layout corresponds to the design layer that indicates target edges for a printed features layer. If any portion of the edge corresponds to the target edge, then it is determined whether to establish an evaluation point on the edge. Then it is determined how to correct the edge for proximity effects based on the evaluation point. In case it is determined that no portion of the edge corresponds to the target edge, then no evaluation point is selected on the edge.
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