Photoresist composition for top-surface imaging process by silylation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 30, 2003
Grant Date -
N/A
app pub date -
Nov 10, 2000
filing date -
Nov 12, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides photoresist compositions for a Top-surface Imaging Process by Silylation (TIPS) and processes for using the same. The photoresist composition comprising a photoresist resin, a photoacid generator, an organic compound, and an amphoteric compound. The amphoteric compound prevents or reduces the amount of acid diffusion into the unexposed area and improves the contrast between the exposed and the unexposed areas. This reduction or prevention of acid diffusion into the unexposed areas reduces line edge roughness (LER).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully