Method for mounting an electronic component
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United States of America Patent
Stats
-
Sep 30, 2003
Grant Date -
Feb 28, 2002
app pub date -
Mar 1, 1999
filing date -
Dec 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements which are mounted on a corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, aNd the carrier is pressed against a first substrate having a plurality of second electrical contacts on a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit which is being tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.
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