Semiconductor package with improved thermal cycling performance, and method of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 30, 2003
Grant Date -
N/A
app pub date -
Nov 17, 2000
filing date -
Dec 8, 1999
priority date (Note) -
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Abstract
A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.
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