Continuous, non-agglomerated adhesion of a seed layer to a barrier layer
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United States of America Patent
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Sep 30, 2003
Grant Date -
N/A
app pub date -
Jun 27, 2000
filing date -
Jul 12, 1999
priority date (Note) -
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Abstract
A method and apparatus is provided for improving adherence of metal seed layers to barrier layers in electrochemical deposition techniques. The method includes depositing an adhesion layer continuously or semi-continuously without agglomeration onto a barrier layer prior to depositing a seed layer by controlling the substrate temperature, the chamber pressure, and/or the power delivered to a deposition chamber. Deposition of the adhesion layer prevents layer delamination which leads to agglomeration of the deposited layers and formation of voids in the high aspect ratio features.
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