Hermetically sealed micro-device package with window
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United States of America Patent
Stats
-
Sep 30, 2003
Issued Date -
N/A
app pub date -
Mar 22, 2002
filing date -
Mar 22, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sidewall includes a frame seal-ring area circumscribing the frame aperture. The frame seal-ring area has a metallic surface. A sheet of a transparent material is provided having a window portion defined thereupon. The window portion has finished top and bottom surfaces. Next, a sheet seal-ring area on the sheet is prepared, the sheet seal-ring area circumscribing the window portion. Next, the prepared sheet seal-ring area of the sheet is metallized. Next, the frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. Next, the junction region is heated until a metal-to-metal joint is formed between the frame and sheet all along the junction region, whereby a hermetic seal circumscribing the window portion is formed.
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