Support circuit with a tapered through-hole for a semiconductor chip assembly
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United States of America Patent
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-
Sep 30, 2003
Issued Date -
N/A
app pub date -
Nov 15, 2001
filing date -
Sep 20, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A support circuit is adapted to be mechanically and electrically coupled to a semiconductor chip such that the support circuit and the chip in combination form a semiconductor chip assembly. The support circuit includes an insulative base and a conductive trace embedded in the insulative base. The conductive trace is a single continuous piece of metal, the conductive trace includes a pillar that extends above the insulative base and a routing line that is substantially covered by and extends below the insulative base, and an opening in the routing line has tapered sidewalls and a diameter that increases as height increases.
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