Semiconductor package including isolated ring structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 30, 2003
Grant Date -
N/A
app pub date -
May 9, 2002
filing date -
May 9, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package includes a chip mounting pad having a peripheral edge. The package further includes a semiconductor chip attached to the chip mounting pad. The package further includes a plurality of leads which each have an inner end disposed adjacent the peripheral edge in spaced relation thereto and an opposing distal end. The package includes at least one isolated ring structure electrically connected to the semiconductor chip and at least one of the leads. The ring structure includes a main body portion disposed along the peripheral edge between the peripheral edge and the inner ends of the leads in spaced relation thereto, and at least one stub portion extending angularly from the main body portion along one of the leads in spaced relation thereto.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully