Method and apparatus for dechucking a substrate from an electrostatic chuck
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 30, 2003
Grant Date -
N/A
app pub date -
Mar 29, 2001
filing date -
Jun 16, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
There is provided a method of dechucking from an electrostatic chuck a substrate held by one or more residual forces to the chuck, the method comprising the steps of: (a) reducing a residual chucking force due to the electrostatic chuck polarisation; (b) contracting the chuck with the substrate attached thereto with a plasma for a time sufficient substantially to remove any residual charge from the surface of the substrate and the chuck; and (c) subsequently to, or simultaneously with, step (b) removing the substrate from the chuck. Also disclosed is an apparatus for performing the method.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully