Importance

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Abstract

A multilayer wiring board having a core substrate and wiring line patterns formed on both faces of the core substrate, the core substrate having conducting members piercing through the core substrate, and members of the wiring line patterns on both faces of the core substrate being connected with each other through the conducting member piercing through the core substrate, wherein the core substrate comprises via columns and conductive structural members, which are formed by plating, and an insulating structural member, which electrically insulates the individual via columns and conductive structural members from each other, the via column piercing through the core substrate and serving as the conducting member for connecting the members of the wiring line patterns on both faces of the core substrate with each other. A method of producing such a multilayer wiring board is also disclosed.

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First Claim