Adsorption process for atomic layer deposition

United States of America Patent

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Oct 7, 2003
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Oct 10, 2002
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Oct 24, 2001
filing date
Apr 5, 2001

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Abstract

A method for conducting an ALD process to deposit layers on a substrate which includes an electrostatic chuck (ESC) to retain the substrate. Electrode(s) in the chuck assembly are used to induce a voltage on the substrate to promote precursor adsorption on the substrate.

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NOVELLUS SYSTEMS INC	3970 NORTH FIRST STREET SAN JOSE CA 95134

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C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....

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Inventor Name	Address	# of filed Patents	Total Citations
Babcoke, Jason E	Menlo Park, CA	15	2442
Brown, Jeffrey A	San Francisco, CA	99	6304
Chiang, Tony P	Santa Clara, CA	208	11473
Leeser, Karl F	Sunnyvale, CA	69	8942

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Adsorption process for atomic layer deposition

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United States of America Patent

09999636

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PATENT NO	6630201
APP PUB NO	20020146511A1
SERIAL NO	09999636
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 07, 2003	US,6630201,B2 US6630201B2	GRANTED PATENT AS SECOND PUBLICATION
October 10, 2002	US,20020146511,A1 US20020146511A1	FIRST PUBLISHED PATENT APPLICATION

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