Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the same
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United States of America Patent
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Oct 7, 2003
Grant Date -
Apr 4, 2002
app pub date -
May 30, 2001
filing date -
May 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The porcelain of the present invention comprises 5 to 70% by weight of a non-oxide ceramic filler and 30 to 95% by weight of a borosilicate glass having a glass transition temperature of 800.degree. C. or lower, wherein a weight loss per unit surface area of said non-oxide ceramics is not more than 0.15 g/cm.sup.2 after dipping said non-oxide ceramic having purity of not less than 96% by weight for five minutes in a glass melt obtained by melting said borosilicate glass with heating at 1200.degree. C. Since the porcelain composition can be fired at a low temperature together with a low-resistance metal, the resulting porcelain has a high thermal conductivity, a low dielectric constant, a high heat dissipation property and a reduced apparent signal delay in a high frequency signal and is suited for use as an insulating board in a wiring board.
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