Components and methods with nested leads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 14, 2003
Grant Date -
Sep 19, 2002
app pub date -
Mar 14, 2001
filing date -
Mar 14, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A component for fabricating microelectronic assemblies has numerous curved leads on a surface. Each lead has a first anchor end fixed to the body of the component, a second tip end which can be bonded to a contact on a mating component and lifted away from the component body, and an elongated main portion which is bent away from the component body in the lifting action. The first anchor end of each lead is nested within the curved portion of another lead, so as to provide an extraordinarily compact arrangement suitable for use with components having closely spaced contacts as, for example, a semiconductor chip or wafer having a contact pitch less than 500 microns. The leads may be disposed in pairs, with the first anchor end of each lead encompassed by the main portion of the other lead in the same pair.
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