US Patent No: 6,633,005

Number of patents in Portfolio can not be more than 2000

Multilayer RF amplifier module

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Importance

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Abstract

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An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRO MOBIO CORPORATIONPALO ALTO, CA39

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichitsubo, Ikuroh Kanagawa Prefecture, JP 42 609
Wang, Guan-Wu Palo Alto, CA 26 334

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
* 5,687,474 Method of assembling and cooling a package structure with accessible chip 15 1996
 
INTERCONNECT SYSTEMS, INC. (1)
* 5,728,248 Method for making a multi-tier laminate substrate with internal heat spreader 7 1996
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
5,874,321 Package integrated circuit having thermal enhancement and reduced footprint size 15 1997
 
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) (2)
* 6,449,168 Circuit board and a method for manufacturing the same 12 1999
* 6,333,856 Arrangement for mounting chips in multilayer printed circuit boards 17 2000
 
LIGHTING SCIENCE GROUP CORPORATION (1)
* 5,847,935 Electronic circuit chip package 30 1996
 
SIGNETICS CORPORATION (1)
* 6,373,131 TBGA semiconductor package 25 1999
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
6,197,613 Wafer level packaging method and devices formed 72 1999
 
INFINEON TECHNOLOGIES AG (1)
* 6,455,925 Power transistor package with integrated flange for surface mount heat removal 26 2001
 
LG SEMICON CO., LTD. (1)
5,933,709 Semiconductor package and method for fabricating same 18 1997
 
MEDIANA ELECTRONICS CO., LTD. (1)
5,943,558 Method of making an assembly package having an air tight cavity and a product made by the method 20 1996
 
COLLABO INNOVATIONS, INC. (2)
* 5,717,249 RF power amplifying circuit device 32 1996
* 5,796,165 High-frequency integrated circuit device having a multilayer structure 66 1996
 
MTEX MATSUMURA CORPORATION (1)
6,048,754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package 16 1994
 
NXP B.V. (1)
5,731,227 Chip on board package with top and bottom terminals 11 1996
 
TAMIRAS PER PTE. LTD., LLC (1)
6,190,939 Method of manufacturing a warp resistant thermally conductive circuit package 7 1998
 
TESSERA, INC. (1)
6,147,401 Compliant multichip package 69 2000
 
NORTHROP GRUMMAN SYSTEMS CORPORATION (1)
* 6,259,335 Combining network to implement a power amplifier having monolithically integrated planar interconnect and transistors 4 1999
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 6,097,612 Radio frequency module and method for fabricating the radio frequency module 15 1997
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
6,146,918 Method of fabricating a semiconductor package 3 1998
 
Brush Wellman, Inc. (1)
6,153,449 Method for creating a hermetic seal and package made thereby 1 1998
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
* 7,129,417 Method and structures for implementing customizable dielectric printed circuit card traces 1 2004
* 2005/0241,850 Method and structures for implementing customizable dielectric printed circuit card traces 1 2004
7,197,818 Method and structures for implementing customizable dielectric printed circuit card traces 0 2006
* 2006/0288,570 Method and structures for implementing customizable dielectric printed circuit card traces 1 2006
 
QUALCOMM INCORPORATED (7)
* 8,119,446 Integrated chip package structure using metal substrate and method of manufacturing the same 6 2002
* 2003/0122,244 Integrated chip package structure using metal substrate and method of manufacturing the same 19 2002
8,535,976 Method for fabricating chip package with die and substrate 1 2003
9,136,246 Integrated chip package structure using silicon substrate and method of manufacturing the same 0 2004
8,471,361 Integrated chip package structure using organic substrate and method of manufacturing the same 2 2011
8,492,870 Semiconductor package with interconnect layers 1 2011
8,835,221 Integrated chip package structure using ceramic substrate and method of manufacturing the same 0 2013
 
Crane Electronics, Inc. (1)
9,230,726 Transformer-based power converters with 3D printed microchannel heat sink 0 2015
 
MICRONAS GMBH (2)
* 7,138,712 Receptacle for a programmable, electronic processing device 1 2003
7,675,165 Mount for a programmable electronic processing device 2 2006
 
TAIYO YUDEN CO., LTD. (2)
* 7,315,455 Surface-mounted electronic component module and method for manufacturing the same 4 2003
* 2004/0042,186 Surface-mounted electronic component module and method for manufacturing the same 2 2003
 
HITACHI, LTD. (3)
* 6,879,488 Radio frequency module 13 2002
* 2003/0128,522 Radio frequency module 4 2002
7,362,576 Radio frequency module 5 2005
 
CITIZEN ELECTRONICS CO., LTD. (1)
* 7,236,372 Surface mounted power supply circuit apparatus and method for manufacturing it 0 2004
 
INFINEON TECHNOLOGIES AG (1)
* 2008/0128,872 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE 2 2007
 
KYOCERA CORPORATION (2)
* 6,961,245 High frequency module 14 2005
* 2005/0146,854 HIGH FREQUENCY MODULE 8 2005
 
NXP B.V. (1)
* 2007/0018,298 Optimized multi-apparation assembly 5 2004
 
Merrimac Industries, Inc. (2)
* 7,297,875 Fusion bonded assembly with attached leads 3 2004
* 2005/0236,178 Fusion bonded assembly with attached leads 0 2004
 
ROBERT BOSCH GMBH (1)
* 2011/0100,681 SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES 2 2009
 
POWER MODULE TECHNOLOGY, INC. (1)
* 2010/0013,559 High frequency amplifying device 0 2008
 
RENESAS ELECTRONICS CORPORATION (2)
* 8,022,551 Solder composition for electronic devices 8 2006
* 2007/0031,279 Solder composition for electronic devices 4 2006
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,989,590 Power semiconductor device with a control circuit board that includes filled through holes 3 2004
 
JTEKT CORPORATION (2)
* 8,415,565 Multilayer circuit substrate 0 2009
* 2010/0065,307 Multilayer circuit substrate 2 2009
 
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (2)
* 8,263,875 Surface mounting structure for a surface mounting electronic component 0 2007
* 2008/0066,955 Surface mounting structure for a surface mounting electronic component 1 2007
 
The United States of America as represented by the Secretary of the Army (1)
* 2013/0199,831 ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS 1 2012
 
BROADCOM CORPORATION (1)
* 7,215,932 On-chip impedance matching power amplifier 2 2005
* Cited By Examiner