US Patent No: 6,633,005

Number of patents in Portfolio can not be more than 2000

Multilayer RF amplifier module

ALSO PUBLISHED AS: 20030076659

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.

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First Claim

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all claims..

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRO MOBIO CORPORATIONPALO ALTO, CA35

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichitsubo, Ikuroh Sagamihara, JP 59 485
Wang, Guan-Wu Palo Alto, CA 26 256

Cited Art Landscape

Patent Info (Count) # Cites Year
 
COLLABO INNOVATIONS, INC. (2)
* 5,717,249 RF power amplifying circuit device 27 1996
* 5,796,165 High-frequency integrated circuit device having a multilayer structure 65 1996
 
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (2)
* 6,449,168 Circuit board and a method for manufacturing the same 9 1999
* 6,333,856 Arrangement for mounting chips in multilayer printed circuit boards 13 2000
 
Brush Wellman Inc. (1)
6,153,449 Method for creating a hermetic seal and package made thereby 1 1998
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
6,146,918 Method of fabricating a semiconductor package 3 1998
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
6,197,613 Wafer level packaging method and devices formed 68 1999
 
INFINEON TECHNOLOGIES AG (1)
* 6,455,925 Power transistor package with integrated flange for surface mount heat removal 24 2001
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
5,874,321 Package integrated circuit having thermal enhancement and reduced footprint size 15 1997
 
INTERCONNECT SYSTEMS, INC. (1)
* 5,728,248 Method for making a multi-tier laminate substrate with internal heat spreader 7 1996
 
LG SEMICON CO., LTD. (1)
5,933,709 Semiconductor package and method for fabricating same 14 1997
 
LIGHTING SCIENCE GROUP CORPORATION (1)
* 5,847,935 Electronic circuit chip package 30 1996
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 6,097,612 Radio frequency module and method for fabricating the radio frequency module 14 1997
 
MEDIANA ELECTRONICS CO., LTD. (1)
5,943,558 Method of making an assembly package having an air tight cavity and a product made by the method 19 1996
 
MTEX MATSUMURA CORPORATION (1)
6,048,754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package 16 1994
 
NORTHROP GRUMMAN SYSTEMS CORPORATION (1)
* 6,259,335 Combining network to implement a power amplifier having monolithically integrated planar interconnect and transistors 4 1999
 
NXP B.V. (1)
5,731,227 Chip on board package with top and bottom terminals 11 1996
 
OVID DATA CO. LLC (1)
6,190,939 Method of manufacturing a warp resistant thermally conductive circuit package 7 1998
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
* 5,687,474 Method of assembling and cooling a package structure with accessible chip 15 1996
 
Signetics Corporation (1)
* 6,373,131 TBGA semiconductor package 24 1999
 
TESSERA, INC. (1)
6,147,401 Compliant multichip package 65 2000
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
QUALCOMM INCORPORATED (5)
* 8,119,446 Integrated chip package structure using metal substrate and method of manufacturing the same 4 2002
8,535,976 Method for fabricating chip package with die and substrate 1 2003
8,471,361 Integrated chip package structure using organic substrate and method of manufacturing the same 1 2011
8,492,870 Semiconductor package with interconnect layers 1 2011
8,835,221 Integrated chip package structure using ceramic substrate and method of manufacturing the same 0 2013
 
HITACHI, LTD. (2)
* 6,879,488 Radio frequency module 10 2002
7,362,576 Radio frequency module 3 2005
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 7,129,417 Method and structures for implementing customizable dielectric printed circuit card traces 1 2004
7,197,818 Method and structures for implementing customizable dielectric printed circuit card traces 0 2006
 
JTEKT CORPORATION (2)
* 8,415,565 Multilayer circuit substrate 0 2009
* 2010/0065,307 Multilayer circuit substrate 1 2009
 
MICRONAS GMBH (2)
* 7,138,712 Receptacle for a programmable, electronic processing device 1 2003
7,675,165 Mount for a programmable electronic processing device 1 2006
 
BROADCOM CORPORATION (1)
* 7,215,932 On-chip impedance matching power amplifier 2 2005
 
CITIZEN ELECTRONICS CO., LTD. (1)
* 7,236,372 Surface mounted power supply circuit apparatus and method for manufacturing it 0 2004
 
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (1)
* 8,263,875 Surface mounting structure for a surface mounting electronic component 0 2007
 
KYOCERA CORPORATION (1)
* 6,961,245 High frequency module 12 2005
 
Merrimac Industries, Inc. (1)
* 7,297,875 Fusion bonded assembly with attached leads 2 2004
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,989,590 Power semiconductor device with a control circuit board that includes filled through holes 1 2004
 
RENESAS ELECTRONICS CORPORATION (1)
* 8,022,551 Solder composition for electronic devices 6 2006
 
TAIYO YUDEN CO., LTD. (1)
* 7,315,455 Surface-mounted electronic component module and method for manufacturing the same 3 2003
* Cited By Examiner

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