Multilayer RF amplifier module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6633005
APP PUB NO 20030076659A1
SERIAL NO

10041863

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRO MOBIO CORPORATIONPALO ALTO, CA44

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichitsubo, Ikuroh Kanagawa Prefecture, JP 42 707
Wang, Guan-Wu Palo Alto, CA 27 386

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
* 5687474 Method of assembling and cooling a package structure with accessible chip 15 1996
 
INTERCONNECT SYSTEMS, INC. (1)
* 5728248 Method for making a multi-tier laminate substrate with internal heat spreader 8 1996
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
5874321 Package integrated circuit having thermal enhancement and reduced footprint size 16 1997
 
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) (1)
* 6333856 Arrangement for mounting chips in multilayer printed circuit boards 20 2000
 
LIGHTING SCIENCE GROUP CORPORATION (1)
* 5847935 Electronic circuit chip package 30 1996
 
SIGNETICS CORPORATION (1)
* 6373131 TBGA semiconductor package 25 1999
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
6197613 Wafer level packaging method and devices formed 83 1999
 
INFINEON TECHNOLOGIES AG (1)
* 6455925 Power transistor package with integrated flange for surface mount heat removal 30 2001
 
LG Semicon Co., Ltd. (1)
5933709 Semiconductor package and method for fabricating same 19 1997
 
MEDIANA ELECTRONICS CO., LTD (1)
5943558 Method of making an assembly package having an air tight cavity and a product made by the method 23 1996
 
COLLABO INNOVATIONS, INC. (2)
* 5717249 RF power amplifying circuit device 33 1996
* 5796165 High-frequency integrated circuit device having a multilayer structure 69 1996
 
TAMIRAS PER PTE. LTD., LLC (1)
6190939 Method of manufacturing a warp resistant thermally conductive circuit package 7 1998
 
MTEX MATSUMURA CORPORATION (1)
6048754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package 16 1994
 
NXP B.V. (1)
5731227 Chip on board package with top and bottom terminals 11 1996
 
Telefonaktiebolaget LM Ericcson (publ) (1)
* 6449168 Circuit board and a method for manufacturing the same 12 1999
 
TESSERA, INC. (1)
6147401 Compliant multichip package 72 2000
 
NORTHROP GRUMMAN SYSTEMS CORPORATION (1)
* 6259335 Combining network to implement a power amplifier having monolithically integrated planar interconnect and transistors 4 1999
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 6097612 Radio frequency module and method for fabricating the radio frequency module 16 1997
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
6146918 Method of fabricating a semiconductor package 3 1998
 
Brush Wellman, Inc. (1)
6153449 Method for creating a hermetic seal and package made thereby 1 1998
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
* 7129417 Method and structures for implementing customizable dielectric printed circuit card traces 1 2004
* 2005/0241,850 Method and structures for implementing customizable dielectric printed circuit card traces 1 2004
7197818 Method and structures for implementing customizable dielectric printed circuit card traces 0 2006
* 2006/0288,570 Method and structures for implementing customizable dielectric printed circuit card traces 1 2006
 
QUALCOMM INCORPORATED (7)
* 8119446 Integrated chip package structure using metal substrate and method of manufacturing the same 6 2002
* 2003/0122,244 Integrated chip package structure using metal substrate and method of manufacturing the same 19 2002
8535976 Method for fabricating chip package with die and substrate 1 2003
9136246 Integrated chip package structure using silicon substrate and method of manufacturing the same 0 2004
8471361 Integrated chip package structure using organic substrate and method of manufacturing the same 2 2011
8492870 Semiconductor package with interconnect layers 1 2011
8835221 Integrated chip package structure using ceramic substrate and method of manufacturing the same 1 2013
 
CRANE ELECTRONICS, INC. (1)
9230726 Transformer-based power converters with 3D printed microchannel heat sink 1 2015
 
TAIYO YUDEN CO., LTD. (2)
* 7315455 Surface-mounted electronic component module and method for manufacturing the same 5 2003
* 2004/0042,186 Surface-mounted electronic component module and method for manufacturing the same 3 2003
 
TDK-MICRONAS GMBH (2)
* 7138712 Receptacle for a programmable, electronic processing device 1 2003
7675165 Mount for a programmable electronic processing device 2 2006
 
HITACHI, LTD. (3)
* 6879488 Radio frequency module 18 2002
* 2003/0128,522 Radio frequency module 11 2002
7362576 Radio frequency module 5 2005
 
CITIZEN ELECTRONICS CO., LTD. (1)
* 7236372 Surface mounted power supply circuit apparatus and method for manufacturing it 0 2004
 
INFINEON TECHNOLOGIES AG (1)
* 2008/0128,872 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE 2 2007
 
KYOCERA MITA CORPORATION (2)
* 6961245 High frequency module 14 2005
* 2005/0146,854 HIGH FREQUENCY MODULE 8 2005
 
NXP B.V. (1)
* 2007/0018,298 Optimized multi-apparation assembly 6 2004
 
Merrimac Industries, Inc. (2)
* 7297875 Fusion bonded assembly with attached leads 3 2004
* 2005/0236,178 Fusion bonded assembly with attached leads 0 2004
 
ROBERT BOSCH GMBH (1)
* 2011/0100,681 SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES 5 2009
 
POWER MODULE TECHNOLOGY, INC. (1)
* 2010/0013,559 High frequency amplifying device 0 2008
 
RENESAS ELECTRONICS CORPORATION (2)
* 8022551 Solder composition for electronic devices 8 2006
* 2007/0031,279 Solder composition for electronic devices 5 2006
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6989590 Power semiconductor device with a control circuit board that includes filled through holes 3 2004
 
JTEKT CORPORATION (2)
* 8415565 Multilayer circuit substrate 1 2009
* 2010/0065,307 Multilayer circuit substrate 4 2009
 
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (2)
* 8263875 Surface mounting structure for a surface mounting electronic component 0 2007
* 2008/0066,955 Surface mounting structure for a surface mounting electronic component 1 2007
 
The United States of America as represented by the Secretary of the Army (1)
* 2013/0199,831 ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS 3 2012
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 7215932 On-chip impedance matching power amplifier 3 2005
* Cited By Examiner