Stepper type test structures and methods for inspection of semiconductor integrated circuits
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United States of America Patent
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Oct 14, 2003
Grant Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Dec 14, 1999
priority date (Note) -
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Abstract
Disclosed is a method of inspecting a sample. The method includes moving to a first field associated with a first group of test structures. The first group of test structures are partially within the first field. The method further includes scanning the first field to determine whether there are any defects present within the first group of test structures. When it is determined that there are defects within the first group of test structures, the method further includes repeatedly stepping to areas and scanning such areas so as to determine a specific defect location within the first group of test structures. A suitable test structure for performing this method is also disclosed.
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