Stepper type test structures and methods for inspection of semiconductor integrated circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6633174
SERIAL NO

09648093

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a method of inspecting a sample. The method includes moving to a first field associated with a first group of test structures. The first group of test structures are partially within the first field. The method further includes scanning the first field to determine whether there are any defects present within the first group of test structures. When it is determined that there are defects within the first group of test structures, the method further includes repeatedly stepping to areas and scanning such areas so as to determine a specific defect location within the first group of test structures. A suitable test structure for performing this method is also disclosed.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KLA-TENCOR CORPORATIONSAN JOSE, CA1142

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adler, David L San Jose, CA 58 1275
Pinto, Gustavo A Belmont, CA 19 789
Richardson, Neil Palo Alto, CA 32 990
Satya, Akella V S Milpitas, CA 20 1259
Walker, David J Sunol, CA 53 1308

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
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MICRON TECHNOLOGY, INC. (1)
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APPLIED MATERIALS, INC. (3)
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6344750 Voltage contrast method for semiconductor inspection using low voltage particle beam 105 1999
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5489852 System for interfacing wafer sort prober apparatus and packaged IC handler apparatus to a common test computer 43 1992
 
The United States of America as represented by the Secretary of the Navy (1)
4902967 Scanning electron microscopy by photovoltage contrast imaging 36 1989
 
FUJITSU SEMICONDUCTOR LIMITED (1)
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KLA Instruments Corporation (7)
4644172 Electronic control of an automatic wafer inspection system 159 1984
5537669 Inspection method and apparatus for the inspection of either random or repeating patterns 134 1993
5502306 Electron beam inspection system and method 245 1994
5578821 Electron beam inspection system and method 241 1995
6021214 Inspection method and apparatus for the inspection of either random or repeating patterns 46 1995
5665968 Inspecting optical masks with electron beam microscopy 63 1996
5717204 Inspecting optical masks with electron beam microscopy 91 1996
 
HITACHI, LTD. (3)
* 4814615 Method and apparatus for detecting defect in circuit pattern of a mask for X-ray exposure 15 1987
* 5051585 Apparatus and method of pattern detection based on a scanning transmission electron microscope 44 1989
* 6476390 Method and apparatus for inspecting integrated circuit pattern using a plurality of charged particle beams 27 2000
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
6061814 Test circuitry for determining the defect density of a semiconductor process as a function of individual metal layers 70 1998
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
HITACHI HIGH-TECHNOLOGIES CORPORATION (1)
* 7764826 Method and apparatus of reviewing defects on a semiconductor device 4 2006
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2011/0101,534 AUTOMATED SHORT LENGTH WIRE SHAPE STRAPPING AND METHODS OF FABRICTING THE SAME 5 2009
 
ADVANCED MICRO DEVICES, INC. (1)
* 7875851 Advanced process control framework using two-dimensional image analysis 1 2006
 
TEXAS INSTRUMENTS INCORPORATED (3)
* 8258806 Self-isolating mixed design-rule integrated yield monitor 2 2008
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9222969 Self-isolating mixed design-rule integrated yield monitor 37 2012
 
SYNOPSYS, INC. (1)
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CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (1)
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9799575 Integrated circuit containing DOEs of NCEM-enabled fill cells 0 2016
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9793253 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least Via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured NCEM-enabled fill cells 0 2016
9761573 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells 0 2016
9741741 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enables fill cells 0 2016
9728553 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells 0 2016
9653446 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and AA-short-configured, NCEM-enabled fill cells 2 2016
9646961 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and metal-short-configured, NCEM-enabled fill cells 1 2016
9627370 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells 2 2016
9627371 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and AA-short-configured, NCEM-enabled fill cells 2 2016
9780083 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, TS-short-configured, metal-short configured, and AA-short-configured, NCEM-enabled fill cells 0 2016
9761574 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATECNT-short-configured, metal-short-configured, and AA-short-configured, NCEM-enabled fill cells 0 2016
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9773773 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cells 0 2016
9761575 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells 0 2016
9691672 Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells 0 2017
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9711496 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configured fill cells 0 2017
9825018 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including tip-to-tip short configured fill cells, and the second DOE including chamfer short configured fill cells 0 2017
9818738 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells with first DOE including tip-to-side short configured fill cells and second DOE including chamfer short configured fill cells 0 2017
9799640 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells 0 2017
9721938 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including tip-to-tip short configured fill cells, and the second DOE including corner short configured fill cells 0 2017
9773774 Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells 0 2017
9748153 Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure 0 2017
9761502 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including merged-via configured fill cells 0 2017
9818660 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including metal island open configured fill cells 0 2017
9786649 Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells 0 2017
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9786650 Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including metal island open configured fill cells 0 2017
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9766970 Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including metal island open configured fill cells 0 2017
 
KLA-TENCOR CORPORATION (2)
7655482 Chemical mechanical polishing test structures and methods for inspecting the same 39 2007
* 2008/0246,030 TEST STRUCTURES AND METHODS FOR INSPECTION OF SEMICONDUCTOR INTEGRATED CIRCUITS 50 2007
 
KLA-TENCOR TECHNOLOGIES CORPORATION (2)
7656170 Multiple directional scans of test structures on semiconductor integrated circuits 44 2007
* 2008/0237,487 MULTIPLE DIRECTIONAL SCANS OF TEST STRUCTURES ON SEMICONDUCTOR INTEGRATED CIRCUITS 7 2007
 
CASCADE MICROTECH, INC. (93)
7233160 Wafer probe 23 2001
7355420 Membrane probing system 7 2002
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7250779 Probe station with low inductance path 26 2003
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7368925 Probe station with two platens 9 2004
7250626 Probe testing structure 4 2004
7221172 Switched suspended conductor and connection 23 2004
7492172 Chuck for holding a device under test 6 2004
7161363 Probe for testing a device under test 35 2004
7268533 Optical testing device 5 2004
7187188 Chuck with integrated wafer support 80 2004
7190181 Probe station having multiple enclosures 8 2004
7138810 Probe station with low noise characteristics 11 2004
7427868 Active wafer probe 22 2004
7221146 Guarded tub enclosure 8 2005
7589518 Wafer probe station having a skirting component 5 2005
7554322 Probe station 6 2005
7330041 Localizing a temperature of a device for testing 8 2005
7330023 Wafer probe station having a skirting component 4 2005
7176705 Thermal optical chuck 3 2005
7368927 Probe head having a membrane suspended probe 34 2005
7352168 Chuck for holding a device under test 9 2005
7420381 Double sided probing structures 3 2005
7164279 System for evaluating probing networks 2 2005
7348787 Wafer probe station having environment control enclosure 6 2005
7656172 System for testing semiconductors 6 2006
7535247 Interface for testing semiconductors 6 2006
7271603 Shielded probe for testing a device under test 35 2006
7449899 Probe for high frequency signals 6 2006
7619419 Wideband active-passive differential signal probe 3 2006
7403025 Membrane probing system 5 2006
7295025 Probe station with low noise characteristics 6 2006
7292057 Probe station thermal chuck with shielding for capacitive current 3 2006
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7504823 Thermal optical chuck 4 2006
7304488 Shielded probe for high-frequency testing of a device under test 10 2006
7321233 System for evaluating probing networks 12 2007
7362115 Chuck with integrated wafer support 14 2007
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7285969 Probe for combined signals 3 2007
7443186 On-wafer test structures for differential signals 6 2007
7639003 Guarded tub enclosure 2 2007
7504842 Probe holder for testing of a test device 4 2007
7468609 Switched suspended conductor and connection 4 2007
7688097 Wafer probe 4 2007
7609077 Differential signal probe with integral balun 4 2007
8069491 Probe testing structure 2 2007
7498828 Probe station with low inductance path 5 2007
7436170 Probe station having multiple enclosures 3 2007
7492147 Wafer probe station having a skirting component 4 2007
7681312 Membrane probing system 4 2007
7541821 Membrane probing system with local contact scrub 2 2007
7453276 Probe for combined signals 7 2007
7518387 Shielded probe for testing a device under test 4 2007
7550984 Probe station with low noise characteristics 4 2007
7616017 Probe station thermal chuck with shielding for capacitive current 2 2007
7761983 Method of assembling a wafer probe 3 2007
7688062 Probe station 0 2007
7495461 Wafer probe 4 2007
7456646 Wafer probe 4 2007
7501842 Shielded probe for testing a device under test 5 2007
7498829 Shielded probe for testing a device under test 5 2007
7417446 Probe for combined signals 7 2007
7969173 Chuck for holding a device under test 2 2007
7518358 Chuck for holding a device under test 12 2007
7514915 Chuck for holding a device under test 10 2007
7501810 Chuck for holding a device under test 11 2007
7423419 Chuck for holding a device under test 9 2007
7626379 Probe station having multiple enclosures 19 2007
7489149 Shielded probe for testing a device under test 3 2007
7482823 Shielded probe for testing a device under test 5 2007
7436194 Shielded probe with low contact resistance for testing a device under test 4 2007
7595632 Wafer probe station having environment control enclosure 6 2008
7492175 Membrane probing system 5 2008
7688091 Chuck with integrated wafer support 1 2008
7514944 Probe head having a membrane suspended probe 5 2008
7750652 Test structure and probe for differential signals 6 2008
8013623 Double sided probing structures 2 2008
7876114 Differential waveguide probe 13 2008
7759953 Active wafer probe 5 2008
7888957 Probing apparatus with impedance optimized interface 10 2008
7898281 Interface for testing semiconductors 4 2008
7898273 Probe for testing a device under test 3 2009
7876115 Chuck for holding a device under test 2 2009
7893704 Membrane probing structure with laterally scrubbing contacts 6 2009
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8410806 Replaceable coupon for a probing apparatus 5 2009
7940069 System for testing semiconductors 4 2009
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9429638 Method of replacing an existing contact of a wafer probing assembly 0 2013
* Cited By Examiner