US Patent No: 6,633,174

Number of patents in Portfolio can not be more than 2000

Stepper type test structures and methods for inspection of semiconductor integrated circuits

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a method of inspecting a sample. The method includes moving to a first field associated with a first group of test structures. The first group of test structures are partially within the first field. The method further includes scanning the first field to determine whether there are any defects present within the first group of test structures. When it is determined that there are defects within the first group of test structures, the method further includes repeatedly stepping to areas and scanning such areas so as to determine a specific defect location within the first group of test structures. A suitable test structure for performing this method is also disclosed.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KLA-TENCOR CORPORATIONSAN JOSE, CA607

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adler, David L San Jose, CA 66 704
Pinto, Gustavo A Belmont, CA 25 371
Richardson, Neil Needham Heights, MA 35 524
Satya, Akella V S Milpitas, CA 24 702
Walker, David J Wadsworth, OH 68 743

Cited Art Landscape

Patent Info (Count) # Cites Year
 
KLA Instruments Corporation (7)
4,644,172 Electronic control of an automatic wafer inspection system 135 1984
5,537,669 Inspection method and apparatus for the inspection of either random or repeating patterns 122 1993
5,502,306 Electron beam inspection system and method 234 1994
5,578,821 Electron beam inspection system and method 210 1995
6,021,214 Inspection method and apparatus for the inspection of either random or repeating patterns 46 1995
5,665,968 Inspecting optical masks with electron beam microscopy 57 1996
5,717,204 Inspecting optical masks with electron beam microscopy 84 1996
 
APPLIED MATERIALS, INC. (3)
6,091,249 Method and apparatus for detecting defects in wafers 80 1998
6,252,412 Method of detecting defects in patterned substrates 140 1999
6,344,750 Voltage contrast method for semiconductor inspection using low voltage particle beam 81 1999
 
HITACHI, LTD. (3)
4,814,615 Method and apparatus for detecting defect in circuit pattern of a mask for X-ray exposure 13 1987
5,051,585 Apparatus and method of pattern detection based on a scanning transmission electron microscope 41 1989
6,476,390 Method and apparatus for inspecting integrated circuit pattern using a plurality of charged particle beams 24 2000
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
5,804,459 Method for charge enhanced defect breakdown to improve yield and reliability 19 1996
5,959,459 Defect monitor and method for automated contactless inline wafer inspection 48 1996
 
RUDOLPH TECHNOLOGIES, INC. (2)
6,292,582 Method and system for identifying defects in a semiconductor 98 1997
6,324,298 Automated wafer defect inspection system and a process of performing such inspection 122 1999
 
FUJITSU SEMICONDUCTOR LIMITED (1)
5,557,105 Pattern inspection apparatus and electron beam apparatus 61 1994
 
LSI LOGIC CORPORATION (1)
6,061,814 Test circuitry for determining the defect density of a semiconductor process as a function of individual metal layers 32 1998
 
MICRON TECHNOLOGY, INC. (1)
6,265,232 Yield based, in-line defect sampling method 66 1998
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,489,852 System for interfacing wafer sort prober apparatus and packaged IC handler apparatus to a common test computer 42 1992
 
The United States of America as represented by the Secretary of the Navy (1)
4,902,967 Scanning electron microscopy by photovoltage contrast imaging 36 1989

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
CASCADE MICROTECH, INC. (92)
7,233,160 Wafer probe 20 2001
7,355,420 Membrane probing system 4 2002
7,138,813 Probe station thermal chuck with shielding for capacitive current 14 2003
7,250,779 Probe station with low inductance path 23 2003
7,761,986 Membrane probing method using improved contact 2 2003
7,368,925 Probe station with two platens 3 2004
7,250,626 Probe testing structure 4 2004
7,221,172 Switched suspended conductor and connection 23 2004
7,492,172 Chuck for holding a device under test 4 2004
7,161,363 Probe for testing a device under test 33 2004
7,268,533 Optical testing device 3 2004
7,187,188 Chuck with integrated wafer support 76 2004
7,190,181 Probe station having multiple enclosures 4 2004
7,138,810 Probe station with low noise characteristics 8 2004
7,427,868 Active wafer probe 10 2004
7,221,146 Guarded tub enclosure 5 2005
7,589,518 Wafer probe station having a skirting component 5 2005
7,554,322 Probe station 5 2005
7,330,041 Localizing a temperature of a device for testing 6 2005
7,330,023 Wafer probe station having a skirting component 3 2005
7,176,705 Thermal optical chuck 3 2005
7,368,927 Probe head having a membrane suspended probe 21 2005
7,352,168 Chuck for holding a device under test 9 2005
7,420,381 Double sided probing structures 1 2005
7,164,279 System for evaluating probing networks 2 2005
7,348,787 Wafer probe station having environment control enclosure 3 2005
7,656,172 System for testing semiconductors 3 2006
7,535,247 Interface for testing semiconductors 3 2006
7,271,603 Shielded probe for testing a device under test 32 2006
7,449,899 Probe for high frequency signals 1 2006
7,619,419 Wideband active-passive differential signal probe 0 2006
7,403,025 Membrane probing system 3 2006
7,295,025 Probe station with low noise characteristics 6 2006
7,292,057 Probe station thermal chuck with shielding for capacitive current 3 2006
7,533,462 Method of constructing a membrane probe 0 2006
7,504,823 Thermal optical chuck 2 2006
7,304,488 Shielded probe for high-frequency testing of a device under test 5 2006
7,321,233 System for evaluating probing networks 7 2007
7,362,115 Chuck with integrated wafer support 14 2007
7,764,072 Differential signal probing system 2 2007
7,723,999 Calibration structures for differential signal probing 0 2007
7,403,028 Test structure and probe for differential signals 20 2007
7,285,969 Probe for combined signals 1 2007
7,443,186 On-wafer test structures for differential signals 3 2007
7,639,003 Guarded tub enclosure 2 2007
7,504,842 Probe holder for testing of a test device 1 2007
7,468,609 Switched suspended conductor and connection 4 2007
7,688,097 Wafer probe 1 2007
7,609,077 Differential signal probe with integral balun 0 2007
8,069,491 Probe testing structure 0 2007
7,498,828 Probe station with low inductance path 5 2007
7,436,170 Probe station having multiple enclosures 3 2007
7,492,147 Wafer probe station having a skirting component 3 2007
7,681,312 Membrane probing system 1 2007
7,541,821 Membrane probing system with local contact scrub 0 2007
7,453,276 Probe for combined signals 1 2007
7,518,387 Shielded probe for testing a device under test 1 2007
7,550,984 Probe station with low noise characteristics 3 2007
7,616,017 Probe station thermal chuck with shielding for capacitive current 0 2007
7,761,983 Method of assembling a wafer probe 1 2007
7,688,062 Probe station 0 2007
7,495,461 Wafer probe 0 2007
7,456,646 Wafer probe 1 2007
7,501,842 Shielded probe for testing a device under test 0 2007
7,498,829 Shielded probe for testing a device under test 1 2007
7,417,446 Probe for combined signals 2 2007
7,969,173 Chuck for holding a device under test 1 2007
7,518,358 Chuck for holding a device under test 12 2007
7,514,915 Chuck for holding a device under test 10 2007
7,501,810 Chuck for holding a device under test 10 2007
7,423,419 Chuck for holding a device under test 9 2007
7,626,379 Probe station having multiple enclosures 2 2007
7,489,149 Shielded probe for testing a device under test 1 2007
7,482,823 Shielded probe for testing a device under test 1 2007
7,436,194 Shielded probe with low contact resistance for testing a device under test 0 2007
7,595,632 Wafer probe station having environment control enclosure 5 2008
7,492,175 Membrane probing system 3 2008
7,688,091 Chuck with integrated wafer support 1 2008
7,514,944 Probe head having a membrane suspended probe 2 2008
7,750,652 Test structure and probe for differential signals 3 2008
8,013,623 Double sided probing structures 0 2008
7,876,114 Differential waveguide probe 0 2008
7,759,953 Active wafer probe 0 2008
7,888,957 Probing apparatus with impedance optimized interface 3 2008
7,898,281 Interface for testing semiconductors 0 2008
7,898,273 Probe for testing a device under test 0 2009
7,876,115 Chuck for holding a device under test 1 2009
7,893,704 Membrane probing structure with laterally scrubbing contacts 2 2009
8,319,503 Test apparatus for measuring a characteristic of a device under test 0 2009
8,410,806 Replaceable coupon for a probing apparatus 0 2009
7,940,069 System for testing semiconductors 1 2009
8,451,017 Membrane probing method using improved contact 0 2010
 
ADVANCED MICRO DEVICES, INC. (1)
7,875,851 Advanced process control framework using two-dimensional image analysis 1 2006
 
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (1)
7,902,548 Planar voltage contrast test structure 1 2006
 
HITACHI HIGH-TECHNOLOGIES CORPORATION (1)
7,764,826 Method and apparatus of reviewing defects on a semiconductor device 2 2006
 
KLA-TENCOR CORPORATION (1)
7,655,482 Chemical mechanical polishing test structures and methods for inspecting the same 2 2007
 
KLA-TENCOR TECHNOLOGIES CORPORATION (1)
7,656,170 Multiple directional scans of test structures on semiconductor integrated circuits 5 2007
 
SYNOPSYS, INC. (1)
6,795,953 Method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design 109 2002
 
TEXAS INSTRUMENTS INCORPORATED (1)
8,258,806 Self-isolating mixed design-rule integrated yield monitor 1 2008

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