Method for fabricating 3-D structures with smoothly-varying topographic features in photo-sensitized epoxy resists
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United States of America Patent
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Oct 21, 2003
Grant Date -
Jan 17, 2002
app pub date -
Jul 10, 2001
filing date -
Jul 11, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method utilizing gray-tone exposure of a class of thick negative photo-sensitized epoxy resists from the substrate side of a transparent substrate and development methods that rely upon a physical distinction between polymerized (solid) and unpolymerized (liquid) photoresist at elevated temperatures may be used to fabricate 3-D structures in the photo-sensitized epoxy. Such structures may exhibit smoothly-varying topographic features with thicknesses as great as 2 mm.
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