Wafer-level MEMS packaging
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United States of America Patent
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Oct 21, 2003
Grant Date -
N/A
app pub date -
Apr 12, 2002
filing date -
Apr 12, 2002
priority date (Note) -
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Abstract
A competitive, simple, single-substrate wafer-level packaging technique capable of creating a vacuum-sealed protective cavity around moving or other particular components of a MEMS is described. The technique uses common semiconductor materials, processing steps and equipment to provide a stable vacuum environment of, for example less than 1 Pa, in a sealed cavity. The environment protects components of the MEMS against micro-contamination from particles and slurry of a waver dicing process and against fluctuations of atmospheric condition to ensure long term reliability.
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