Importance

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Abstract

A method of making a semiconductor chip assembly includes the steps of providing a semiconductor chip with contacts and a dielectric substrate wiring layer with terminals, forming a plurality of conductive elastomeric posts such that each post connects one terminal to one contact, and after forming the conductive elastomeric posts, injecting compliant material between the semiconductor chip and the dielectric substrate wiring layer to form a compliant layer. Another method of making a semiconductor chip assembly includes providing a semiconductor chip with contacts and a dielectric substrate wiring layer with terminals, dispensing a conductive elastomeric material over each of the contacts or over each of the terminals, juxtaposing the chip and the wiring layer such that conductive elastomeric material connects each contact to one of the terminals, and after the juxtaposing step, injecting a compliant material between the chip and the wiring layer and around the conductive elastomeric material to form a compliant layer, and curing the conductive elastomeric material and the compliant material.

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First Claim