Method of manufacturing semiconductor device
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United States of America Patent
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Oct 21, 2003
Grant Date -
Nov 15, 2001
app pub date -
Mar 15, 1999
filing date -
Mar 13, 1998
priority date (Note) -
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Abstract
A pre-stripping treatment solution for treatment of metal surfaces before stripping photoresist which has been used for patterning a metal layer. Also provided is a method of removing the photoresist, and a method of manufacturing semiconductor devices using the above solution and method. In one aspect of the invention, the photoresist is first ashed. The ashed resultant structure is then treated, prior to stripping of the photoresist, with a pre-stripping treatment solution of an organic acid solution having a carboxyl group is mixed with deionized water at a volume ratio of 1:0 to 1:100.
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