Circuit board having side attach pad traces through buried conductive material
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United States of America Patent
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Oct 21, 2003
Issued Date -
N/A
app pub date -
Mar 28, 2001
filing date -
Sep 17, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.
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