Electronic device and optical transmission module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 21, 2003
Grant Date -
Jul 11, 2002
app pub date -
Jan 11, 2002
filing date -
Jan 11, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.
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