Heat dissipation device
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United States of America Patent
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-
Oct 21, 2003
Grant Date -
Jun 5, 2003
app pub date -
Dec 5, 2001
filing date -
Dec 5, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat dissipation device includes a heat sink (30), a metal plate (50), and a clip (20). The heat sink has a chassis (36) with thermally conductive material (40) applied thereunder. The metal plate is attached to the material in order to be in thermal contact with the chassis. The metal plate is then directly attached to a CPU (60). The clip is engaged with a socket (70) that supports the CPU, to facilitate the metal plate intimately contacting the CPU. The metal plate prevents the CPU from moving from the socket should the heat dissipation device be accidentally moved or displaced. This reduces any risk of damage to the CPU. In addition, heat generated from the CPU is efficiently removed.
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