Multi-material heat spreader
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
Sep 11, 2003
app pub date -
Mar 8, 2002
filing date -
Mar 8, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
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