Heat resistant material for molds and other articles
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United States of America Patent
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Oct 28, 2003
Grant Date -
N/A
app pub date -
Jun 27, 2001
filing date -
Jun 27, 2001
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A particulate silicone based material and method for forming a heat resistant composite is provided. The particulate silicone based material is heated to a temperature between about 200.degree. F. and about 400.degree. F. The particulate silicone based material is cooled until a solid composite is formed. The solid composite is resistant to melting and thermal decomposition when heated to temperatures of at least 3000.degree. F. The particulate silicone based material may be formed by mixing liquid silicone resin with a catalyst and powdered silicone molding compound.
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