IC-mounted card substrate and IC-mounted personal-data certification card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
Nov 14, 2002
app pub date -
Jan 22, 2002
filing date -
Jan 25, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC-mounted card substrate comprising a first sheet member having at least a first support, a second sheet member having at least a second support and an electronic part fixing layer having therein an IC-module and provided between the first sheet member and the second sheet member, wherein the second sheet member has a cushion layer comprising an actinic ray-cured resin on the second support, and a displacement value of needle penetration of the cushion layer obtained by a thermo-mechanical analysis (TMA) apparatus is not more than 30% at temperature of 100.degree. C. and not less than 30% at a temperature of 150.degree. C. based on the thickness of the cushion layer.
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