Semiconductor structure including a partially annealed layer and method of forming the same

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United States of America Patent

PATENT NO 6638838
SERIAL NO

09678372

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Abstract

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High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. To further relieve strain in the accommodating buffer layer, at least a portion of the accommodating buffer layer is exposed to a laser anneal process to cause the accommodating buffer layer to become amorphous, providing a true compliant substrate for subsequent layer growth.

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Patent Owner(s)

  • FREESCALE SEMICONDUCTOR, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eisenbeiser, Kurt Tempe, AZ 22 493
Finder, Jeffrey M Chandler, AZ 13 195
Foley, Barbara M Gilbert, AZ 13 354
Thompson, Danny L Mesa, AZ 8 417

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