Hole metal-filling method
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United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
May 1, 2003
app pub date -
Oct 30, 2001
filing date -
Oct 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.
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