Method and system for processing one or more microstructures of a multi-material device
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United States of America Patent
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Oct 28, 2003
Issued Date -
N/A
app pub date -
Mar 27, 2002
filing date -
Mar 29, 2001
priority date (Note) -
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Abstract
A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.
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