Single layer surface mount package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
Aug 8, 2002
app pub date -
Feb 1, 2002
filing date -
Feb 2, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A single layer surface mount package suitable for use with a high frequency microelectronic device includes a lead frame partially embedded in a dielectric material and a lid. The dielectric material is integrally formed or molded into the cavities between the leads and die attach area of the lead frame such that at least the die attach area remains exposed on the top and the bottom surface of the dielectric material. A sufficient length of each lead remains exposed beyond the perimeter of the dielectric material for surface mounting to a circuit of a next level assembly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully