Dummy wafers and methods for making the same
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United States of America Patent
Stats
-
Oct 28, 2003
Grant Date -
May 8, 2003
app pub date -
Nov 7, 2001
filing date -
Nov 7, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Dummy wafers that are used in IC manufacturing and methods for manufacturing the same are described. The dummy wafers are made with an increased resistance to breaking during CVD manufacturing process. The dummy wafers are made by placing a protective film over the wafer surface(s) exposed during the CVD process. By increasing the resistance to breaking, the protective film extends the useful life of the dummy wafers.
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